LINK
LINK
Mobility × Pick-and-Place Capability,
Becoming the Free Agent of the Production Line
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LINK

The Link series of robots are a new generation of intelligent handling robots developed for intelligent manufacturing, integrating three core functions: SALM automatic navigation, material recognition, and precise pick-and-place operations. Utilizing high-precision SLAM laser navigation technology in conjunction with a vision recognition system, they can accurately identify materials and complete high-precision pick-and-place tasks. The end-effectors are designed with modularity, allowing for customization to meet the handling requirements of various materials. Equipped with multiple types of sensors, they ensure safe operation in human-robot collaborative environments, providing automated solutions for smart factories.

Products

LINK-300EL-SRA-12
LINK-300EL-SRA-12
A differential drive embodied robot with a maximum end-effector load of 12kg, which addresses the automated handling of carriers such as cassettes in the packaging and testing processes of semiconductors. The composite robot completes the transportation of carriers like cassettes using the mechanical arm's gripping method, achieving full automation docking.
Max. Speed
1.5 m/s
Duration
8 Hours
Payload
12kg
Dimensions
950*620*946mm
Rotating Radius
500mm
LINK-300EL-SRA-12-SRT
LINK-300EL-SRA-12-SRT
A 12kg maximum end-effector load differential drive transport embodied robot, which completes the transportation of cassettes, materials, fixtures, etc., using the mechanical arm's gripping method. It can also complete the pick-and-place of entire trays of materials through the transport module, improving the docking efficiency with raw material and finished product warehouses.
Max. Speed
1.5 m/s
Duration
8 Hours
Payload
12kg
Dimensions
1050*800*1050mm
Rotating Radius
550mm
LINK-600EL-SRA-20-SRT
LINK-600EL-SRA-20-SRT
A differential drive transport embodied robot with a maximum end-effector load of 20kg, which completes the transportation of cassettes, materials, fixtures, etc., using the mechanical arm's gripping method. It can also complete the pick-and-place of entire trays of materials through the transport module, improving the docking efficiency with raw material and finished product warehouses.
Max. Speed
1.5 m/s
Duration
8 Hours
Payload
20kg
Dimensions
1150*820*1100mm
Rotating Radius
600mm
LINK-OWD-SRA-C-FOUP-12
LINK-OWD-SRA-C-FOUP-12
12-inch FOUP omnidirectional semiconductor embodied robot, which addresses the automated handling of carriers such as wafer cassettes in the wafer manufacturing processes of semiconductors. Specifically developed for the semiconductor industry, the composite robot uses a collaborative robotic arm to handle common types of carriers in wafer manufacturing, such as FOUP, FOSB, and BOX, completing the transportation and loading/unloading of wafers.
Max. Speed
1.5 m/s
Duration
8 Hours
Payload
20kg
Dimensions
1146*646*1222mm
Rotating Radius
625mm
LINK-OWD-SRA-C-BOX-8
LINK-OWD-SRA-C-BOX-8
8-inch BOX omnidirectional semiconductor embodied robot, which addresses the automated handling of carriers such as wafer cassettes in the wafer manufacturing processes of semiconductors. Specifically developed for the semiconductor industry, the composite robot uses a collaborative robotic arm to handle common types of carriers in wafer manufacturing, such as FOUP, FOSB, and BOX, completing the transportation and loading/unloading of wafers.
Max. Speed
1.5 m/s
Duration
8 Hours
Payload
12kg
Dimensions
1146*646*1222mm
Rotating Radius
625mm

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